Designing a 3D-IC is complicated endeavour. We know, we've done it! It requires you to consider
chiplet and IP floorplaning, power, thermal, substrate floorplan and connectivity, materails,
assembly and
manufacturing. All of that while considering with different usage scenarios.
To help us in our 3D-IC design journey we developed the DankaChiplet™ platform - a leading
edge 3D-IC and Chiplet
architecture exploration and design software. Whether you are exploring 3D-IC
architectures, Chiplet Design variants and scenarios, substrate options, system and
environmental conditions - we've got it!
Let us join You in your exciting journey of 3D-IC design!
